Method of fabricating semiconductor device

ABSTRACT

After successively depositing a first metal film and a first silicon oxide film on an insulating film formed on a semiconductor substrate, etching is carried out by using a first resist pattern as a mask, so as to form a first interlayer insulating film having openings from the first silicon oxide film and first metal interconnects from the first metal film. A third interlayer insulating film of an organic film is filled in the openings of the first interlayer insulating film, and the first interlayer insulating film is etched by using a hard mask. A second metal film is then filled in a space in the second interlayer insulating film, so as to form second metal interconnects.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a method of fabricating asemiconductor device having multilayer interconnects.

[0002] Recently remarkably developed semiconductor process techniqueshave enabled super refinement and high integration of interconnects andsemiconductor devices, and hence, ULSIs have been largely improved intheir performance.

[0003] In accordance with improvement in the integration ofinterconnects, however, the operation speed of a device has becomerestricted by delay of a signal on an interconnect.

[0004] Accordingly, in a ULSI of the 0.25 μm generation or later, SiO₂(with a dielectric constant ε of 4.3) conventionally used as a materialfor an interlayer insulating film is to be replaced with anothermaterial with a smaller dielectric constant, such as SiOF doped withfluorine (ε=3.5) and SiO:C including an organic substance (ε=2.8 through3.2) (hereinafter referred to as organic SOG).

[0005] Now, a method of fabricating a semiconductor device in which thedielectric constant between interconnects is reduced by using organicSOG disclosed in Japanese Laid-Open Patent Publication No. 9-82799 willbe described with reference to FIGS. 34(a) through 34(e).

[0006] First, as is shown in FIG. 34(a), an aluminum alloy film with athickness of 500 nm is deposited on a semiconductor substrate 10, and afirst SiOF film (including 6 atom % of fluorine and having a dielectricconstant of 3) with a thickness of 200 nm is then deposited on thealuminum alloy film by plasma enhanced CVD. Next, the first SiOF film ispatterned into a mask pattern 12 by using a resist pattern as a mask,the resist pattern is then removed, and the aluminum alloy film ispatterned into lower-layer interconnects 11 (with a minimum line spacingof 300 nm) by using the mask pattern 12.

[0007] Then, as is shown in FIG. 34(b), a second SiOF film 13 (including6 atom % of fluorine and having a dielectric constant of 3) with athickness of 100 nm is deposited on the entire surface of thesemiconductor substrate 10 by the plasma enhanced CVD. An organic SOGfilm 14 (having a dielectric constant of 3) with a thickness of 750 nmis then deposited on the second SiOF film 13, and the organic SOG film14 is locally flattened.

[0008] Next, as is shown in FIG. 34(c), the organic SOG film 14 isentirely flattened by CMP using an abrasive of pH 9 including dispersednoncrystal cerium oxide, thereby forming a first interlayer insulatingfilm 14A. In this case, the CMP is carried out until a portion of theorganic SOG film 14 above the lower-layer interconnects 11 is removed,but the lower-layer interconnects 11 are never exposed because thesecond SiOF film 13 works as an etching stopper.

[0009] Then, as is shown in FIG. 34(d), a second interlayer insulatingfilm 15 of a silicon oxide film is deposited on the entire surface ofthe semiconductor substrate 10 by the plasma enhanced CVD.

[0010] Thereafter, as is shown in FIG. 34(e), via holes 15 a are formedin the second interlayer insulating film 15, and upper-layerinterconnects 16 connected to the lower-layer interconnects 11 throughthe via holes 15 a are formed on the second interlayer insulating film15.

[0011] In a semiconductor device fabricated as described above,parasitic capacity between the lower-layer interconnects 11 having theminimum line spacing therebetween is measured, resulting in finding thatthe dielectric constant is 3 and that the parasitic capacity is small.

[0012] The conventional method of fabricating a semiconductor devicehas, however, the following problems when the line width of thelower-layer interconnect 11 is designed to be the same as the dimensionof the via hole 15 a and alignment shift is caused in thephotolithography for forming the via holes 15 a:

[0013]FIG. 35 shows the structure of a via hole 17 formed when thealignment shift is caused. When the alignment is shifted, a portion tobe etched is shifted from the upper face of the lower-layer interconnect11 and the etching proceeds to the second SiOF film 13 and the firstinterlayer insulating film 14A. Therefore, not only the contact areabetween the via hole 17 and the lower-layer interconnect 11 is reducedbut also the aspect ratio of the via hole 17 is increased. When theaspect ratio of the via hole 17 is increased, a cavity is formed in theupper-layer interconnect 16 during the formation thereof (see FIG.34(e)), and a gas is generated from the organic SOG film used forforming the first interlayer insulating film 14A. As a result, a viacontact defect can be disadvantageously caused.

SUMMARY OF THE INVENTION

[0014] In consideration of the aforementioned conventional problems, anobject of the invention is, in a method of fabricating a semiconductordevice designed to have a width of a metal interconnect the same as adimension of a via hole connected to the upper face of the metalinterconnect, preventing position shift of a via contact against themetal interconnect even when alignment shift is caused in a mask patternused for forming the via hole.

[0015] In order to achieve the object, the first method of fabricating asemiconductor device of this invention comprises the steps ofsuccessively depositing a first metal film and a first interlayerinsulating film on an insulating film formed on a semiconductorsubstrate; forming a first mask pattern for masking first metalinterconnect forming areas on the first interlayer insulating film, andetching the first interlayer insulating film and the first metal film byusing the first mask pattern, whereby forming openings in the firstinterlayer insulating film and forming first metal interconnects fromthe first metal film; filling a second interlayer insulating film madefrom a different material from the first interlayer insulating film inthe openings of the first interlayer insulating film; forming a secondmask pattern having via openings corresponding to via hole forming areason the first interlayer insulating film and the second interlayerinsulating film; etching the first interlayer insulating film by usingthe second mask pattern under etching conditions that an etching ratefor the first interlayer insulating film is higher than an etching ratefor the second interlayer insulating film, whereby forming via holes forexposing the first metal interconnects in the second interlayerinsulating film; depositing a second metal film on the first interlayerinsulating film and the second interlayer insulating film so as to fillthe via holes; depositing a third interlayer insulating film on thesecond metal film; forming a third mask pattern for masking second metalinterconnect forming areas on the third interlayer insulating film, andetching the second interlayer insulating film and the second metal filmby using the third mask pattern, whereby forming openings in the thirdinterlayer insulating film and forming second metal interconnects fromthe second metal film; and filling a fourth interlayer insulating filmin an interval in the second metal interconnects and in the openings ofthe third interlayer insulating film.

[0016] In the first method of fabricating a semiconductor device, thefirst interlayer insulating film and the first metal film are etched byusing the first mask pattern, so as to form the openings in the firstinterlayer insulating film and form the first metal interconnects fromthe first metal film. Therefore, the width of the opening of the firstinterlayer insulating film accords with the line width of the firstmetal interconnect. Accordingly, the space in the second interlayerinsulating film filled in the openings of the first interlayerinsulating film accords with the line width of the first metalinterconnect.

[0017] Therefore, when the via holes are formed in the second interlayerinsulating film by etching the first interlayer insulating film by usingthe second mask pattern having the via openings under etching conditionsthat the etching rate for the first interlayer insulating film is higherthan the etching rate for the second interlayer insulating film, thedimension of each via hole in the perpendicular direction to theinterconnect is smaller than both the dimension of the via opening ofthe second mask pattern and the line width of the first metalinterconnect. Accordingly, in the design where the line width of thefirst metal interconnect and the dimension of the via hole are the same,the via contact is never shifted from the first metal interconnect evenwhen the alignment shift is caused in the second mask pattern.

[0018] In this manner, the increase of the aspect ratio of the via holecan be suppressed in the first method of fabricating a semiconductordevice, and hence, no cavity is formed in the via contact. As a result,a contact defect can be prevented from being caused in the via contact.

[0019] In the first method of fabricating a semiconductor device, thefirst interlayer insulating film is preferably made from a materialincluding an inorganic component as a main component, and the secondinterlayer insulating film is preferably made from a material includingan organic component as a main component.

[0020] In this manner, the interlayer insulating film including anorganic component as a main component and having a small dielectricconstant is disposed in the interval in the first metal interconnects,resulting in reducing the capacity between the first metalinterconnects. Furthermore, the interlayer insulating film including aninorganic component as a main component and having a good heatconducting property is disposed between the first metal interconnect andthe second metal interconnect, resulting in improving a heat releasingproperty in the first and second metal interconnects. Thus, the etchingconditions that the etching rate for the first interlayer insulatingfilm is higher than the etching rate for the second interlayerinsulating film can be easily set.

[0021] In the first method of fabricating a semiconductor device, thesecond interlayer insulating film preferably has a smaller dielectricconstant than the first interlayer insulating film.

[0022] In this manner, the interlayer insulating film having a smalldielectric constant is disposed in the interval in the first metalinterconnects, resulting in reducing the capacity between the firstmetal interconnects.

[0023] In the first method of fabricating a semiconductor device, thesecond mask pattern is preferably a hard mask made from a metalmaterial.

[0024] In this manner, it is easy to provide the second mask patternwith etching selectivity against the first interlayer insulating filmand the second interlayer insulating film. Therefore, the etchingconditions that the etching rate for the first interlayer insulatingfilm is higher than the etching rate for the second interlayerinsulating film can be easily set.

[0025] In the first method of fabricating a semiconductor device, eachof the via openings is preferably in a larger plan shape than each ofthe via holes.

[0026] In this manner, even when the alignment shift is caused in thesecond mask pattern, the dimension of each via contact can be preventedfrom being smaller than the line width of the first metal interconnect.

[0027] The second method of fabricating a semiconductor device of thisinvention comprises the steps of successively depositing a first metalfilm and a first interlayer insulating film on an insulating film formedon a semiconductor substrate; forming a first mask pattern for maskingfirst metal interconnect forming areas on the first interlayerinsulating film, and etching the first interlayer insulating film andthe first metal film by using the first mask pattern, whereby formingopenings in the first interlayer insulating film and forming first metalinterconnects from the first metal film; filling a second interlayerinsulating film made from a different material from the first interlayerinsulating film in an interval in the first metal interconnects and inthe openings of the first interlayer insulating film; depositing asacrifice film of an insulating material on the first interlayerinsulating film and the second interlayer insulating film; forming asecond mask pattern for masking second metal interconnect forming areason the sacrifice film, and etching the sacrifice film by using thesecond mask pattern, whereby forming interconnect patterns from thesacrifice film; filling a third interlayer insulating film in aninterval in the interconnect patterns; forming a third mask patternhaving via openings corresponding to via hole forming areas on theinterconnect patterns and the third interlayer insulating film, andetching the interconnect patterns and the first interlayer insulatingfilm by using the third mask pattern under etching conditions that anetching rate for the interconnect patterns is higher than an etchingrate for the third interlayer insulating film and that an etching ratefor the first interlayer insulating film is higher than an etching ratefor the second interlayer insulating film, whereby forming via holes forexposing the first metal interconnects in the second interlayerinsulating film; forming interconnect openings in the third interlayerinsulating film by removing the interconnect patterns; and filling asecond metal film in the via holes of the second interlayer insulatingfilm and in the interconnect openings of the third interlayer insulatingfilm, whereby simultaneously forming via contacts and second metalinterconnects from the second metal film.

[0028] In the second method of fabricating a semiconductor device, thefirst interlayer insulating film and the first metal film are etched byusing the first mask pattern, so as to form the openings in the firstinterlayer insulating film and form the first metal interconnects fromthe first metal film. Therefore, the width of the opening of the firstinterlayer insulating film accords with the line width of the firstmetal interconnect, and hence, the space in the second interlayerinsulating film filled in the openings of the first interlayerinsulating film accords with the line width of the first metalinterconnect.

[0029] Accordingly, when the via holes are formed in the secondinterlayer insulating film by etching the first interlayer insulatingfilm by using the third mask pattern having the via openings underetching conditions that the etching rate for the first interlayerinsulating film is higher than the etching rate for the secondinterlayer insulating film, the dimension of each via hole in theperpendicular direction to the interconnect is smaller than both thedimension of the via opening of the third mask pattern and the linewidth of the first metal interconnect. Accordingly, in the design inwhich the line width of the first metal interconnect is the same as thedimension of the via hole, the via contact can be prevented fromshifting from the first metal interconnect even when the alignment shiftis caused in the second mask pattern. Thus, the increase of the aspectratio of the via hole can be suppressed, resulting in preventingoccurrence of a via contact defect.

[0030] Furthermore, after forming the interconnect patterns by etchingthe sacrifice film by using the second mask pattern for masking thesecond metal interconnect forming area, the third interlayer insulatingfilm is filled in the interval in the interconnect patterns. Therefore,the space in the third interlayer insulating film accords with the widthof the second metal interconnect forming area, and hence, the width ofeach interconnect opening formed in the third interlayer insulating filmnaturally accords with the width of the second metal interconnectforming area. Accordingly, the second metal interconnects are obtainedby filling the second metal film in the interconnect openings of thethird interlayer insulating film. Thus, buried interconnects having adual damascene structure in which each via contact is never shifted fromthe first metal interconnect can be formed in a self-alignment manner.

[0031] In the second method of fabricating a semiconductor device, thefirst interlayer insulating film is preferably made from a materialincluding an inorganic component as a main component, and each of thesecond interlayer insulating film and the third interlayer insulatingfilm is preferably made from a material including an organic componentas a main component.

[0032] In this manner, the interlayer insulating films both includingorganic components as main components and having small dielectricconstants are respectively disposed between the first metalinterconnects and between the second metal interconnects, resulting inreducing the capacity between the first metal interconnects and betweenthe second metal interconnects. Also, the interlayer insulating filmincluding an inorganic component as a main component and having a goodheat conducting property is disposed between the first metalinterconnect and the second metal interconnect, resulting in improvingthe heat releasing property in the first and second metal interconnects.Furthermore, the etching conditions that the etching rate for the firstinterlayer insulating film is higher than the etching rate for thesecond interlayer insulating film can be easily set.

[0033] In the second method of fabricating a semiconductor device, thesecond interlayer insulating film and the third interlayer insulatingfilm preferably have smaller dielectric constants than the firstinterlayer insulating film.

[0034] In this manner, the interlayer insulating films having smalldielectric constants are respectively disposed between the first metalinterconnects and between the second metal interconnects, resulting inreducing the capacity between the first metal interconnects and betweenthe second metal interconnects.

[0035] In the second method of fabricating a semiconductor device, thethird mask pattern is preferably a hard mask made from a metal material.

[0036] When the third mask pattern is thus a hard mask made from a metalmaterial, it is easy to provide the third mask pattern with the etchingselectivity against the first interlayer insulating film and the secondinterlayer insulating film. Therefore, the etching conditions that theetching rate for the first interlayer insulating film is higher than theetching rate for the second interlayer insulating film can be easilyset.

[0037] In the second method of fabricating a semiconductor device, eachof the via openings is preferably in a larger plan shape than each ofthe via holes.

[0038] In this manner, even when the alignment shift is caused in thethird mask pattern, the dimension of each via contact can be preventedfrom being smaller than the line width of the first metal interconnect.

[0039] The third method of fabricating a semiconductor device of thisinvention comprises the steps of successively depositing a first metalfilm and a first interlayer insulating film on an insulating film formedon a semiconductor substrate; forming a first mask pattern for maskingfirst metal interconnect forming areas on the first interlayerinsulating film, and etching the first interlayer insulating film andthe first metal film by using the first mask pattern, whereby formingopenings in the first interlayer insulating film and forming first metalinterconnects from the first metal film; filling a second interlayerinsulating film made from a different material from the first interlayerinsulating film in an interval in the first metal interconnects and inthe openings of the first interlayer insulating film; successivelydepositing a second metal film and a third interlayer insulating film onthe first interlayer insulating film and the second interlayerinsulating film; forming a second mask pattern for masking second metalinterconnect forming areas on the third interlayer insulating film, andetching the third interlayer insulating film and the second metal filmby using the second mask pattern, whereby forming openings in the thirdinterlayer insulating film and forming second metal interconnects fromthe second metal film; filling a fourth interlayer insulating film in aninterval in the second metal interconnects and in the openings of thethird interlayer insulating film; forming a third mask pattern havingvia openings corresponding to via hole forming areas on the thirdinterlayer insulating film and the fourth interlayer insulating film;etching the third interlayer insulating film by using the third maskpattern under etching conditions that an etching rate for the thirdinterlayer insulating film is higher than an etching rate for the fourthinterlayer insulating film, whereby forming via openings in the fourthinterlayer insulating film; etching the second metal interconnects byusing the third mask pattern, whereby forming via openings in the secondmetal interconnects; etching the first interlayer insulating film byusing the third mask pattern under etching conditions that an etchingrate for the first interlayer insulating film is higher than an etchingrate for the second interlayer insulating film, whereby forming viaholes for exposing the first metal interconnects in the secondinterlayer insulating film; filling a third metal film in the via holesof the second interlayer insulating film and in the via openings of thesecond metal interconnect, whereby forming via contacts from the thirdmetal film and connecting the via contacts to the second metalinterconnects through the third metal film; and filling a buryinginsulating film in the via openings of the fourth interlayer insulatingfilm.

[0040] In the third method of fabricating a semiconductor device, thefirst interlayer insulating film and the first metal film are etched byusing the first mask pattern, so as to form the openings in the firstinterlayer insulating film and form the first metal interconnects fromthe first metal film. Therefore, the width of the opening of the firstinterlayer insulating film accords with the line width of the firstmetal interconnect, and hence, the space in the second interlayerinsulating film filled in the openings of the first interlayerinsulating film accords with the line width of the first metalinterconnect.

[0041] Accordingly, when the via holes are formed in the secondinterlayer insulating film by etching the first interlayer insulatingfilm by using the third mask pattern having the via openings underetching conditions that the etching rate for the first interlayerinsulating film is higher than the etching rate for the secondinterlayer insulating film, the dimension of each via hole in theperpendicular direction to the interconnect is smaller than both thedimension of the via opening of the third mask pattern and the linewidth of the first metal interconnect. Accordingly, in the design inwhich the line width of the first metal interconnect is the same as thedimension of the via hole, the via contact is never shifted from thefirst metal interconnect even when the alignment shift is caused in thesecond mask pattern. Thus, the increase of the aspect ratio of the viahole can be suppressed, resulting in preventing the occurrence of a viacontact defect.

[0042] Furthermore, after forming the via openings in the second metalinterconnects and the via holes in the second interlayer insulating filmby using the third mask pattern, the third metal film is filled in thevia holes and the via openings, so as to form the contacts and connectthe second metal interconnects. Therefore, the via contacts and thesecond metal interconnects can be simultaneously formed. Thus, buriedinterconnects having a dual damascene structure in which each viacontact is never shifted from the first metal interconnect can be formedin a self-alignment manner, and a semiconductor device having amultilayer interconnect structure including three or more layers can bedefinitely fabricated by repeating procedures subsequent to theformation of the third mask pattern.

[0043] In the third method of fabricating a semiconductor device, thefirst interlayer insulating film is preferably made from a materialincluding an inorganic component as a main component, and each of thesecond interlayer insulating film and the fourth interlayer insulatingfilm is preferably made from a material including an organic componentas a main component.

[0044] In this manner, the interlayer insulating films both includingorganic components as main components and having small dielectricconstants are respectively disposed between the first metalinterconnects and between the second metal interconnects, resulting inreducing the capacity between the first metal interconnects and betweenthe second metal interconnects. Also, the interlayer insulating filmincluding an inorganic component as a main component and having a goodheat conducting property is disposed between the first metalinterconnect and the second metal interconnect, resulting in improvingthe heat releasing property in the first and second metal interconnects.Furthermore, the etching conditions that the etching rate for the firstinterlayer insulating film is higher than the etching rate for thesecond interlayer insulating film can be easily set.

[0045] In the third method of fabricating a semiconductor device, thesecond interlayer insulating film and the fourth interlayer insulatingfilm preferably have smaller dielectric constants than the firstinterlayer insulating film.

[0046] In this manner, the interlayer insulating films having smalldielectric constants are respectively disposed between the first metalinterconnects and between the second metal interconnects, resulting inreducing the capacity between the first metal interconnects and betweenthe second metal interconnects.

[0047] In the third method of fabricating a semiconductor device, thethird mask pattern is preferably a hard mask made from a metal material.

[0048] In this manner, it is easy to provide the third mask pattern withthe etching selectivity against the first interlayer insulating film andthe second interlayer insulating film, and hence, the etching conditionsthat the etching rate for the first interlayer insulating film is higherthan the etching rate for the second interlayer insulating film can beeasily set.

[0049] In the third method of fabricating a semiconductor device, eachof the via openings is preferably in a larger plan shape than each ofthe via holes.

[0050] In this manner, even when the alignment shift is caused in thethird mask pattern, the dimension of each via contact can be preventedfrom being smaller than the line width of the first metal interconnect.

BRIEF DESCRIPTION OF THE DRAWINGS

[0051] FIGS. 1(a) and 1(b) show a procedure in a method of fabricating asemiconductor device according to Embodiment 1, wherein FIG. 1(a) is asectional view taken on line Ia-Ia of FIG. 1(b) and FIG. 1(b) is a planview;

[0052] FIGS. 2(a) and 2(b) show a procedure in the method of fabricatinga semiconductor device according to Embodiment 1, wherein FIG. 2(a) is asectional view taken on line IIa-IIa of FIG. 2(b) and FIG. 2(b) is aplan view;

[0053] FIGS. 3(a) and 3(b) show a procedure in the method of fabricatinga semiconductor device according to Embodiment 1, wherein FIG. 3(a) is asectional view taken on line IIIa-IIIa of FIG. 3(b) and FIG. 3(b) is aplan view;

[0054] FIGS. 4(a) and 4(b) show a procedure in the method of fabricatinga semiconductor device according to Embodiment 1, wherein FIG. 4(a) is asectional view taken on line IVa-IVa of FIG. 4(b) and FIG. 4(b) is aplan view;

[0055] FIGS. 5(a) and 5(b) show a procedure in the method of fabricatinga semiconductor device according to Embodiment 1, wherein FIG. 5(a) is asectional view taken on line Va-Va of FIG. 5(b) and FIG. 5(b) is a planview;

[0056] FIGS. 6(a) and 6(b) show a procedure in the method of fabricatinga semiconductor device according to Embodiment 1, wherein FIG. 6(a) is asectional view taken on line VIa-VIa of FIG. 6(b) and FIG. 6(b) is aplan view;

[0057] FIGS. 7(a) and 7(b) show a procedure in the method of fabricatinga semiconductor device according to Embodiment 1, wherein FIG. 7(a) is asectional view taken on line VIIa-VIIa of FIG. 7(b) and FIG. 7(b) is aplan view;

[0058] FIGS. 8(a) and 8(b) show a procedure in the method of fabricatinga semiconductor device according to Embodiment 1, wherein FIG. 8(a) is asectional view taken on line VIIIa-VIIIa of FIG. 8(b) and FIG. 8(b) is aplan view;

[0059] FIGS. 9(a) through 9(c) show a procedure in a method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 9(a) is a sectional view taken on line IXa-IXa of FIG. 9(c), FIG.9(b) is a sectional view taken on line IXb-IXb of FIG. 9(c) and FIG.9(c) is a plan view;

[0060] FIGS. 10(a) through 10(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 10(a) is a sectional view taken on line Xa-Xa of FIG. 10(c), FIG.10(b) is a sectional view taken on line Xb-Xb of FIG. 10(c) and FIG.10(c) is a plan view;

[0061] FIGS. 11(a) through 11(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 11(a) is a sectional view taken on line XIa-XIa of FIG. 11(c), FIG.11(b) is a sectional view taken on line XIb-XIb of FIG. 11(c) and FIG.11(c) is a plan view;

[0062] FIGS. 12(a) through 12(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 12(a) is a sectional view taken on line XIIa-XIIa of FIG. 12(c),FIG. 12(b) is a sectional view taken on line XIIb-XIIb of FIG. 12(c) andFIG. 12(c) is a plan view;

[0063] FIGS. 13(a) through 13(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 13(a) is a sectional view taken on line XIIIa-XIIIa of FIG. 13(c),FIG. 13(b) is a sectional view taken on line XIIIb-XIIIb of FIG. 13(c)and FIG. 13(c) is a plan view;

[0064] FIGS. 14(a) through 14(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 14(a) is a sectional view taken on line XIVa-XIVa of FIG. 14(c),FIG. 14(b) is a sectional view taken on line XIVb-XIVb of FIG. 14(c) andFIG. 14(c) is a plan view;

[0065] FIGS. 15(a) through 15(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 15(a) is a sectional view taken on line XVa-XVa of FIG. 15(c), FIG.15(b) is a sectional view taken on line XVb-XVb of FIG. 15(c) and FIG.15(c) is a plan view;

[0066] FIGS. 16(a) through 16(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 16(a) is a sectional view taken on line XVIa-XVIa of FIG. 16(c),FIG. 16(b) is a sectional view taken on line XVIb-XVIb of FIG. 16(c) andFIG. 16(c) is a plan view;

[0067] FIGS. 17(a) through 17(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 17(a) is a sectional view taken on line XVIIa-XVIIa of FIG. 17(c),FIG. 17(b) is a sectional view taken on line XVIIb-XVIIb of FIG. 17(c)and FIG. 17(c) is a plan view;

[0068] FIGS. 18(a) through 18(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 18(a) is a sectional view taken on line XVIIIa-XVIIIa of FIG.18(c), FIG. 18(b) is a sectional view taken on line XVIIIb-XVIIIb ofFIG. 18(c) and FIG. 18(c) is a plan view;

[0069] FIGS. 19(a) through 19(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 19(a) is a sectional view taken on line XIXa-XIXa of FIG. 19(c),FIG. 19(b) is a sectional view taken on line XIXb-XIXb of FIG. 19(c) andFIG. 19(c) is a plan view;

[0070] FIGS. 20(a) through 20(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 2, whereinFIG. 20(a) is a sectional view taken on line XXa-XXa of FIG. 20(c), FIG.20(b) is a sectional view taken on line XXb-XXb of FIG. 20(c) and FIG.20(c) is a plan view;

[0071] FIGS. 21(a) through 21(c) show a procedure in a method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 21(a) is a sectional view taken on line XXIa-XXIa of FIG. 21(c),FIG. 21(b) is a sectional view taken on line XXIb-XXIb of FIG. 21(c) andFIG. 21(c) is a plan view;

[0072] FIGS. 22(a) through 22(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 22(a) is a sectional view taken on line XXIIa-XXIIa of FIG. 22(c),FIG. 22(b) is a sectional view taken on line XXIIb-XXIIb of FIG. 22(c)and FIG. 22(c) is a plan view;

[0073] FIGS. 23(a) through 23(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 23(a) is a sectional view taken on line XXIIIa-XXIIIa of FIG.23(c), FIG. 23(b) is a sectional view taken on line XXIIIb-XXIIIb ofFIG. 23(c) and FIG. 23(c) is a plan view;

[0074] FIGS. 24(a) through 24(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 24(a) is a sectional view taken on line XXIVa-XXIVa of FIG. 24(c),FIG. 24(b) is a sectional view taken on line XXIVb-XXIVb of FIG. 24(c)and FIG. 24(c) is a plan view;

[0075] FIGS. 25(a) through 25(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 25(a) is a sectional view taken on line XXVa-XXVa of FIG. 25(c),FIG. 25(b) is a sectional view taken on line XXVb-XXVb of FIG. 25(c) andFIG. 25(c) is a plan view;

[0076] FIGS. 26(a) through 26(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 26(a) is a sectional view taken on line XXVIa-XXVIa of FIG. 26(c),FIG. 26(b) is a sectional view taken on line XXVIb-XXVIb of FIG. 26(c)and FIG. 26(c) is a plan view;

[0077] FIGS. 27(a) through 27(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 27(a) is a sectional view taken on line XXVIIa-XXVIIa of FIG.27(c), FIG. 27(b) is a sectional view taken on line XXVIIb-XXVIIb ofFIG. 27(c) and FIG. 27(c) is a plan view;

[0078] FIGS. 28(a) through 28(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 28(a) is a sectional view taken on line XXVIIIa-XXVIIIa of FIG.28(c), FIG. 28(b) is a sectional view taken on line XXVIIIb-XXVIIIb ofFIG. 28(c) and FIG. 28(c) is a plan view;

[0079] FIGS. 29(a) through 29(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 29(a) is a sectional view taken on line XXIXa-XXIXa of FIG. 29(c),FIG. 29(b) is a sectional view taken on line XXIXb-XXIXb of FIG. 29(c)and FIG. 29(c) is a plan view;

[0080] FIGS. 30(a) through 30(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 30(a) is a sectional view taken on line XXXa-XXXa of FIG. 30(c),FIG. 30(b) is a sectional view taken on line XXXb-XXXb of FIG. 30(c) andFIG. 30(c) is a plan view;

[0081] FIGS. 31(a) through 31(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 31(a) is a sectional view taken on line XXXIa-XXXIa of FIG. 31(c),FIG. 31(b) is a sectional view taken on line XXXIb-XXXIb of FIG. 31(c)and FIG. 31(c) is a plan view;

[0082] FIGS. 32(a) through 32(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 32(a) is a sectional view taken on line XXXIIa-XXXIIa of FIG.32(c), FIG. 32(b) is a sectional view taken on line XXXIIb-XXXIIb ofFIG. 32(c) and FIG. 32(c) is a plan view;

[0083] FIGS. 33(a) through 33(c) show a procedure in the method offabricating a semiconductor device according to Embodiment 3, whereinFIG. 33(a) is a sectional view taken on line XXXIIIa-XXXIIIa of FIG.33(c), FIG. 33(b) is a sectional view taken on line XXXIIIb-XXXIIIb ofFIG. 33(c) and FIG. 33(c) is a plan view;

[0084] FIGS. 34(a) through 34(e) are sectional views for showingprocedures in a conventional method of fabricating a semiconductordevice; and

[0085]FIG. 35 is a diagram for explaining problems caused in theconventional method of fabricating a semiconductor device.

DETAILED DESCRIPTION OF THE INVENTION

[0086] Embodiment 1

[0087] Now, a method of fabricating a semiconductor device according toEmbodiment 1 of the invention will be described with reference to FIGS.1(a), 1(b), 2(a), 2(b), 3(a), 3(b), 4(a), 4(b), 5(a), 5(b), 6(a), 6(b),7(a), 7(b), 8(a) and 8(b).

[0088] First, as is shown in FIGS. 1(a) and 1(b), an insulating film 101with a thickness of 2.0 μm is formed on the entire surface of asemiconductor substrate 100 bearing a semiconductor active device notshown. Then, a first metal film 102 with a thickness of 0.5 μm of amulti-layer film including a copper film and a tantalum alloy film suchas a TaN film is deposited on the insulating film 101 by sputtering orelectroplating. Then, a first silicon oxide film 103 with a thickness of1.0 μm is deposited on the first metal film 102, and a first resistpattern 104 having openings corresponding to interconnect forming areasof a first layer is formed on the first silicon oxide film 103. Next, asis shown in FIGS. 2(a) and 2(b), the first silicon oxide film 103 isetched by using a CF etching gas at a low temperature with the firstresist pattern 104 used as a mask, thereby forming a first interlayerinsulating film 103A. Thereafter, the first metal film 102 is etched soas to expose the insulating film 101 by using a Cl etching gas at a hightemperature, thereby forming first metal interconnects 102A having aline spacing 105. Then, the first resist pattern 104 is removed.

[0089] Subsequently, as is shown in FIGS. 3(a) and 3(b), an organic filmis deposited on the entire surface of the semiconductor substrate 100 bya spin coater method or plasma enhanced CVD, and a portion of theorganic film exposed on the first metal interconnects 102A is removed byCMP. Thus, the line spacing 105 in the first metal interconnects 102A isfilled with a second interlayer insulating film 106 of the organic film.An example of the material for the organic film is an organic substanceincluding organic polysiloxane or fluorine. The organic film made fromsuch a material is characterized by a smaller dielectric constant thanthe first silicon oxide film 103 (first interlayer insulating film 103A)and a lower etching rate against a CF etching gas than the first siliconoxide film 103. Since the second interlayer insulating film 106 has asmall dielectric constant, the capacity between the first metalinterconnects 102A can be reduced.

[0090] Then, as is shown in FIGS. 4(a) and 4(b), a second silicon oxidefilm 107 and a titanium nitride film 108 are successively deposited onthe entire surface of the semiconductor substrate 100. Thereafter, asecond resist pattern 109 having via openings 110 is formed on thetitanium nitride film 108 by lithography.

[0091] Next, as is shown in FIGS. 5(a) and 5(b), the titanium nitridefilm 108 is etched by using a Cl etching gas with the second resistpattern 109 used as a mask, thereby transferring the via openings 110onto the titanium nitride film 108. Thus, a hard mask 108A having thevia openings 110 is formed. Then, the second resist pattern 109 isremoved.

[0092] Subsequently, as is shown in FIGS. 6(a) and 6(b), the secondsilicon oxide film 107 and the first interlayer insulating film 103A arecontinuously etched by using a CF etching gas with the hard mask 108Aused as a mask, thereby forming via holes 111 in the first interlayerinsulating film 103A. In this case, since the second interlayerinsulating film 106 and the first interlayer insulating film 103A aremade from different materials, the second interlayer insulating film 106is minimally etched by the CF etching gas. Therefore, the via openings110 can be selectively formed in the second silicon oxide film 107, andthe two adjacent via holes 111 can be simultaneously formed in the firstinterlayer insulating film 103A. In this case, the dimension along lineVIa-VIa of each via opening 110 is set to be equal to a sum of linewidths W of the two first metal interconnects 102A, the line spacingbetween the first metal interconnects 102A and clearances ó on bothsides. Thus, the via holes 111 can be definitely formed on the firstmetal interconnects 102A even when alignment shift is caused in thesecond resist pattern 109 and further in the hard mask 108A, and hence,an exposure margin in the lithography can be increased.

[0093] Next, as is shown in FIGS. 7(a) and 7(b), a second metal film 112with a thickness of 0.5 μm of a multi-layer film including a copper filmand a tantalum alloy film such as a TaN film is deposited on the entiresurface of the semiconductor substrate 110 by the sputtering or theelectroplating so as to fill the via holes 111. Then, a third siliconoxide film 113 with a thickness of 1.0 μm is deposited on the secondmetal film 112, and a third resist pattern 114 having openingscorresponding to interconnect forming areas of a second layer is formedon the third silicon oxide film 113.

[0094] Then, as is shown in FIGS. 8(a) and 8(b), the third silicon oxidefilm 113 is etched by using a CF etching gas at a low temperature withthe third resist pattern 114 used as a mask, thereby forming a thirdinterlayer insulating film 113A having via holes. Thereafter, the secondmetal film 112 is etched by using a Cl etching gas at a hightemperature, thereby forming second metal interconnects 112A. Then,after removing the third resist pattern 114, an organic film made from,for example, an organic substance including organic polysiloxane orfluorine is deposited on the entire surface of the semiconductorsubstrate 100, and a portion of the organic film exposed on the thirdinterlayer insulating film 113A is removed by the CMP. Thus, a fourthinterlayer insulating film 115 is filled in the line spacing in thesecond metal interconnects 112A and the via holes of the thirdinterlayer insulating film 113A.

[0095] The aforementioned procedures can be repeated so as to fabricatea semiconductor device having a multilayer interconnect structure.

[0096] According to Embodiment 1, the second interlayer insulating film106 of the organic film having a smaller dielectric constant than thefirst interlayer insulating film 103A (first silicon oxide film 103) isfilled in the interval in the first metal interconnects 102A, and thefourth interlayer insulating film 115 of the organic film having asmaller dielectric constant than the third interlayer insulating film113A (third silicon oxide film 113) is filled in the interval in thesecond metal interconnects 112A. Accordingly, the capacity between thefirst metal interconnects 102A and between the second metalinterconnects 112A can be reduced. Furthermore, since the firstinterlayer insulating film 103A (first silicon oxide film 103) better inthe heat conducting property than the organic films is disposed betweenthe first metal interconnect 102A and the second metal interconnect112A, heat generated in the first metal interconnect 102A and the secondmetal interconnect 112A can be easily released.

[0097] Furthermore, according to Embodiment 1, the via holes 111 areformed in the first interlayer insulating film 103A by etching thesecond silicon oxide film 107 and the first interlayer insulating film103A by using the hard mask 108A having the via openings 110. Therefore,the via holes 111 can be formed in a self-alignment manner. In thiscase, by setting the size of each via opening 110 formed in the secondresist pattern 109 to be larger than the line width of the first metalinterconnect 102A, the via holes 111 can be definitely formed on thefirst metal interconnects 102A even when the alignment shift is causedin the second resist pattern 109 and further in the hard mask 108A.

[0098] Embodiment 2

[0099] Now, a method of fabricating a semiconductor device according toEmbodiment 2 of the invention will be described with reference to FIGS.9(a) through 9(c), 10(a) through 10(c), 11(a) through 11(c), 12(a)through 12(c), 13(a) through 13(c), 14(a) through 14(c), 15(a) through15(c), 16(a) through 16(c), 17(a) through 17(c), 18(a) through 18(c),19(a) through 19(c) and 20(a) through 20(c).

[0100] First, as is shown in FIGS. 9(a) through 9(c), an insulating film201 having a thickness of 2.0 μm is deposited on the entire surface of asemiconductor substrate 200 bearing a semiconductor active device notshown. Then, a first metal film 202 with a thickness of 0.5 μm of amulti-layer film including a copper film and a tantalum alloy film suchas a TaN film is deposited on the insulating film 201 by the sputteringor the electroplating. Thereafter, a first silicon oxide film 203 with athickness of 1.0 μm is deposited on the first metal film 202, and afirst resist pattern 204 having openings corresponding to interconnectforming areas of a first layer is formed on the first silicon oxide film203.

[0101] Next, as is shown in FIGS. 10(a) through 10(c), the first siliconoxide film 203 is etched by using a CF etching gas at a low temperaturewith the first resist pattern 204 used as a mask, thereby forming afirst interlayer insulating film 203A. Then, the first metal film 202 isetched so as to expose the insulating film 201 by using a Cl etching gasat a high temperature, thereby forming first metal interconnects 202Ahaving a first line spacing 205. Then, the first resist pattern 204 isremoved.

[0102] Subsequently, as is shown in FIGS. 11(a) through 11(c), a secondinterlayer insulating film 206 of an organic film is deposited on theentire surface of the semiconductor substrate 200 by the spin coatermethod or the plasma enhanced CVD, and a portion of the secondinterlayer insulating film 206 exposed on the first metal interconnects202A is removed by the CMP. An example of the material for the organicfilm used for forming the second interlayer insulating film 206 is anorganic substance including organic polysiloxane or fluorine. Theorganic film made from such a material is characterized by a smallerdielectric constant than the first silicon oxide film 203 (firstinterlayer insulating film 203A) and a lower etching rate against a CFetching gas than the first silicon oxide film 203. Since the secondinterlayer insulating film 206 has a small dielectric constant, thecapacity between the first metal interconnects 202A can be reduced.

[0103] Next, as is shown in FIGS. 12(a) through 12(c), a first stopperfilm 207 of, for example, a silicon nitride film and a sacrifice film208 of, for example, a silicon oxide film are successively deposited onthe entire surface of the semiconductor substrate 200. Thereafter, asecond resist pattern 209 having openings corresponding to line spacingsof a second layer is formed on the sacrifice film 208.

[0104] Then, as is shown in FIGS. 13(a) through 13(c), the sacrificefilm 208 is etched by using the second resist pattern 209 as a mask andthe first stopper film 207 as an etching stopper, thereby forminginterconnect patterns 208A having a second line spacing 210. Thereafter,the second resist pattern 209 is removed. The interconnect patterns 208Aare to be replaced with second metal interconnects in the future.

[0105] Subsequently, as is shown in FIGS. 14(a) through 14(c), a thirdinterlayer insulating film 211 of an organic film is deposited on theentire surface of the semiconductor substrate 200 by the spin coatermethod or the plasma enhanced CVD, and a portion of the third interlayerinsulating film 211 exposed on the interconnect patterns 208A is removedby the CMP. Thus, the top surface of the third interlayer insulatingfilm 211 is placed at the same level as the top surfaces of theinterconnect patterns 208A. An example of the material used for formingthe third interlayer insulating film 211 is an organic substanceincluding organic polysiloxane or fluorine similarly to the secondinterlayer insulating film 206.

[0106] Next, as is shown in FIGS. 15(a) through 15(c), a second stopperfilm 212 of, for example, a silicon nitride film and a titanium nitridefilm 213 are successively deposited on the entire surface of thesemiconductor substrate 200, and a third resist pattern 214 having viaopenings 216 is formed on the titanium nitride film 213.

[0107] Then, as is shown in FIGS. 16(a) through 16(c), the titaniumnitride film 213 is etched by using the third resist pattern 214 as amask and the second stopper film 212 as an etching stopper, therebyforming a hard mask 213A onto which the via openings 216 have beentransferred.

[0108] Thereafter, as is shown in FIGS. 17(a) through 17(c), the secondstopper film 212, the interconnect patterns 208A, the first stopper film207 and the first interlayer insulating film 203A are successivelyetched by a CF etching gas with the hard mask 213A used as a mask,thereby forming via holes 217 in the first interlayer insulating film203A and the second interlayer insulating film 206. In this case, eachvia opening 216 of the third resist pattern 214 is set to have adimension W₃ corresponding to the line width W₁ of the first metalinterconnect 202A and the line width W₂ of a second metal interconnect215A (see FIGS. 20(a) through 20(c)) both provided with clearances ó onboth sides. Thus, the alignment shift caused in the lithography can becanceled. Furthermore, since the side faces exposed to the opening ofthe third interlayer insulating film 211 and the second interlayerinsulating film 206 made from the organic films work as side etchingstoppers in the etching, the via holes 217 each having a dimension ofW₁×W₂ can be definitely formed on the first metal interconnects 202A ina self-alignment manner.

[0109] Next, as is shown in FIGS. 18(a) through 18(c), after removingthe hard mask 213A by using an etching gas for a metal film, theinterconnect patterns 208A are etched by using a patterned first stopperfilm 207A as an etching stopper, thereby removing the interconnectpatterns 208A. In this case, since the third interlayer insulating film211 is made from the organic film and hence has an etching resistanceagainst the etching gas for a metal film, the shape of the thirdinterlayer insulating film 211 can be satisfactorily kept.

[0110] Then, although not shown in the drawings, an adhesion layer of avery thin TaN film and a seed layer of a copper film are formed on theentire surface of the semiconductor substrate 200 including the viaholes 217. Thereafter, as is shown in FIGS. 19(a) through 19(c), acopper film 215 is deposited so as to fill the via holes 217 by theelectroplating.

[0111] Next, as is shown in FIGS. 20(a) through 20(c), a portion of thecopper film 215 exposed on the third interlayer insulating film 211 isremoved by the CMP, resulting in obtaining the second metalinterconnects 215A having a dual damascene structure.

[0112] According to Embodiment 2, the second interlayer insulating film206 of the organic film having a small dielectric constant is disposedin the interval in the first metal interconnects 202A, and the thirdinterlayer insulating film 211 of the organic film having a smalldielectric constant is disposed in the interval in the second metalinterconnects 215A. Therefore, the capacity between the first metalinterconnects 202A and between the second metal interconnects 215A canbe reduced. Furthermore, the first interlayer insulating film 203A(first silicon oxide film 203) better in the heat conducting propertythan the organic films is disposed between the first metal interconnect202A and the second metal interconnect 215A. Therefore, heat generatedin the first metal interconnect 202A and the second metal interconnect215A can be easily released.

[0113] Furthermore, according to Embodiment 2, the via holes 217 areformed in the first interlayer insulating film 203A and the secondinterlayer insulating film 206 by successively etching the secondstopper film 221, the interconnect patterns 208A, the first stopper film207 and the first interlayer insulating film 203A by using the hard mask213A having the via openings 216 as a mask. Therefore, the via holes 217can be formed in a self-alignment manner. In this case, by setting thesize of each via opening 216 formed in the third resist pattern 214 tobe larger than the line width of the first metal interconnect 202A andthe line width of the second metal interconnect 215A formed in thesubsequent procedure, the via holes 217 can be definitely formed on thefirst metal interconnects 202A even when the alignment shift is causedin the third resist pattern 214.

[0114] Embodiment 3

[0115] Now, a method of fabricating a semiconductor device according toEmbodiment 3 of the invention will be described with reference to FIGS.21(a) through 21(c), 22(a) through 22(c), 23(a) through 23(c), 24(a)through 24(c), 25(a) through 25(c), 26(a) through 26(c), 27(a) through27(c), 28(a) through 28(c), 29(a) through 29(c), 30(a) through 30(c),31(a) through 31(c), 32(a) through 32(c) and 33(a) though 33(c).

[0116] First, as is shown in FIGS. 21(a) through 21(c), an insulatingfilm 301 having a thickness of 2.0 μm is formed on the entire surface ofa semiconductor substrate 300 bearing a semiconductor active device notshown. Then, a first metal film 302 with a thickness of 0.5 μm of amulti-layer film including a copper film and a tantalum alloy film suchas a TaN film is deposited on the insulating film 301 by the sputteringor the electroplating. Thereafter, a first silicon oxide film 303 with athickness of 1.0 μm is deposited on the first metal film 302, and afirst resist pattern 304 having openings corresponding to interconnectforming areas of a first layer is formed on the first silicon oxide film303.

[0117] Next, the first silicon oxide film 303 is etched by using a CFetching gas at a low temperature with the first resist pattern 304 usedas a mask, and the first metal film 302 is etched by using a Cl etchinggas at a high temperature. Thus, as is shown in FIGS. 22(a) through22(c), a first interlayer insulating film 303A is formed from the firstsilicon oxide film 303 and first metal interconnects 302A having a firstline spacing 305 are formed. Then, the first resist pattern 304 isremoved.

[0118] Thereafter, as is shown in FIGS. 23(a) through 23(c), a secondinterlayer insulating film 306 of an organic film is deposited on theentire surface of the semiconductor substrate 300 by the spin coatermethod or the plasma enhanced CVD, and a portion of the secondinterlayer insulating film 306 exposed on the first metal interconnects302A is removed by the CMP. An example of the material for the organicfilm used for forming the second interlayer insulating film 306 is anorganic substance including organic polysiloxane or fluorine. Theorganic film made from such a material is characterized by a smallerdielectric constant than the first silicon oxide film 303 (firstinterlayer insulating film 303A) and a lower etching rate against a CFetching gas than the first silicon oxide film 303. Since the secondinterlayer insulating film 306 has a small dielectric constant, thecapacity between the first metal interconnects 302A can be reduced.

[0119] Next, as is shown in FIGS. 24(a) through 24(c), a first stopperfilm 307 of a silicon nitride film, a second metal film 308 with athickness of 0.5 μm of a multi-layer film including a copper film and atantalum alloy film such as a TaN film, and a second silicon oxide film309 with a thickness of 1.0 μm are successively deposited on the entiresurface of the semiconductor substrate 300. Thereafter, a second resistpattern 310 having openings corresponding to interconnect forming areasof a second layer is formed on the second silicon oxide film 309.

[0120] Then, as is shown in FIGS. 25(a) through 25(c), the secondsilicon oxide film 309 is etched by using the second resist pattern 310as a mask, thereby forming a third interlayer insulating film 309A.Subsequently, the second metal film 308 is etched by using the firststopper film 307 as an etching stopper, thereby forming second metalinterconnects 308A having a second line spacing 311. Then, the secondresist pattern 310 is removed.

[0121] Subsequently, as is shown in FIGS. 26(a) through 26(c), a fourthinterlayer insulating film 312 of an organic film is deposited on theentire surface of the semiconductor substrate 300 by the spin coatermethod or the plasma enhanced CVD, and a portion of the fourthinterlayer insulating film 312 exposed on the third interlayerinsulating film 309A is removed by the CMP. Thus, the top surface of thefourth interlayer insulating film 312 is placed at the same level as thetop surface of the third interlayer insulating film 309A. An example ofthe material for the organic film used for forming the fourth interlayerinsulating film 312 is an organic substance including organicpolysiloxane or fluorine. Thereafter, a second stopper film 313 of asilicon nitride film, a first titanium nitride film 314, a third stopperfilm 315 of a silicon nitride film and a second titanium nitride film316 are successively deposited on the third interlayer insulating film309A and the fourth interlayer insulating film 312. Then, a third resistpattern 317 having via openings 320 is formed on the second titaniumnitride film 316.

[0122] Next, as is shown in FIGS. 27(a) through 27(c), the secondtitanium nitride film 316, the third stopper film 315 and the firsttitanium nitride film 314 are successively etched by using the thirdresist pattern 317 as a mask and the second stopper film 313 as anetching stopper. Thus, a second hard mask 316A, a patterned thirdstopper film 315A and a first hard mask 314A are formed, and the thirdresist pattern 317 is then removed.

[0123] Then, as is shown in FIGS. 28(a) through 28(c), the secondstopper film 313 and the third interlayer insulating film 309A areetched by using an etching gas for a silicon oxide film with the secondhard mask 316A used as a mask, thereby forming a patterned secondstopper film 313A and transferring the via openings 320 onto the thirdinterlayer insulating film 309A. This etching is completed when the topsurfaces of the second metal interconnects 308A are exposed. Also, sincethe fourth interlayer insulating film 312 is made from the organic filmand hence is minimally etched by the etching gas for a silicon oxidefilm, the shape of the fourth interlayer insulating film 312 can besatisfactorily kept.

[0124] Subsequently, as is shown in FIGS. 29(a) through 29(c), thesecond metal interconnects 308A are etched by using an etching gas for ametal film with the patterned third stopper film 315A used as a mask,thereby transferring the via openings 320 onto the second metalinterconnects 308A. During this etching, the second hard mask 316Aremaining on the patterned third stopper film 315A is removed.

[0125] Next, as is shown in FIGS. 30(a) through 30(c), the first stopperfilm 307 and the first interlayer insulating film 303A are etched byusing an etching gas for a silicon oxide film with the first hard mask314A as a mask, thereby forming a patterned first stopper film 307A andforming via holes 321 in the first interlayer insulating film 303A. Thisetching is completed when the top surfaces of the first metalinterconnects 302A are exposed. Also, since the second interlayerinsulating film 306 is made from the organic film and hence is minimallyetched by the etching gas for a silicon oxide film, the shape of thesecond interlayer insulating film 306 can be satisfactorily kept. Duringthis etching, the patterned first stopper film 315A remaining on thefirst hard mask 314A is removed. In this case, each via opening 320 ofthe third resist pattern 317 is set to have a dimension W₃ correspondingto the line width W₁ of the first metal interconnect 302A and the linewidth W₂ of the second metal interconnect 308A both provided withclearances 6 on both sides. Thus, the alignment shift caused in thelithography can be canceled. Furthermore, the side faces exposed to theopening of the fourth interlayer insulating film 312 and the secondinterlayer insulating film 306 made from the organic films work as sideetching stoppers in the etching, and hence, the via holes 321 eachhaving a dimension of W₁×W₂ can be definitely formed on the first metalinterconnects 302A in a self-alignment manner.

[0126] Thereafter, although not shown in the drawings, an adhesion layerof a very thin TaN film and a seed layer of a copper film are formed onthe entire surface of the semiconductor substrate 300 including the viaholes 321. Then, as is shown in FIGS. 31(a) through 31(c), a copper film318 is deposited so as to fill the via holes 321 by the electroplating.Thus, the first metal interconnects 302A and the second metalinterconnects 308A are connected through the copper film 318, and thesecond metal interconnects 308A are mutually connected through thecopper film 318. Instead of depositing the copper film 318 by theelectroplating, a tungsten film can be deposited by a blanket methodwith a TiN material used as an underlying film.

[0127] Then, as is shown in FIGS. 32(a) through 32(c), the copper film318 and the first hard mask 314A are etched by using an etching gas fora metal film until the top surface of the copper film 318 is placed atthe same level as the top surfaces of the second metal interconnects308A. Thus, via contacts 318A are formed from the copper film 318.

[0128] Next, as is shown in FIGS. 33(a) through 33(c), a buryinginsulating film 319 is deposited on the entire surface of thesemiconductor substrate 300, and a portion of the burying insulatingfilm 319 exposed on the patterned second stopper film 313A is removed bythe CMP, thereby flattening the burying insulating film 319.

[0129] The aforementioned procedures are repeated so as to fabricate asemiconductor device having a multilayer interconnect structureincluding three or more interconnect layers.

[0130] According to Embodiment 3, the second interlayer insulating film306 of the organic film having a small dielectric constant is disposedin the interval in the first metal interconnects 302A and the fourthinterlayer insulating film 312 of the organic film having a smalldielectric constant is disposed in the interval in the second metalinterconnects 308A. Therefore, the capacity between the first metalinterconnects 302A and between the second metal interconnects 308A canbe reduced. Furthermore, the first interlayer insulating film 303A(first silicon oxide film 303) better in the heat conducting propertythan the organic films is disposed between the first metal interconnect302A and the second metal interconnect 308A. Therefore, heat generatedin the first metal interconnect 302A and the second metal interconnect308A can be easily released.

[0131] Furthermore, according to Embodiment 3, the via holes 321 areformed in the first interlayer insulating film 303A by etching the firstinterlayer insulating film 303A with the first hard mask 314A having thevia openings 320 used as a mask. Therefore, the via holes 321 can beformed in a self-alignment manner. In this case, by setting the size ofeach via opening 320 formed in the third resist pattern 317 to be largerthan the line width of the first metal interconnect 302A and the linewidth of the second metal interconnect 308A formed in the subsequentprocedure, the via holes 321 can be definitely formed on the first metalinterconnects 302A even when the alignment shift is caused in the thirdresist pattern 317 and further in the first hard mask 314A and thesecond hard mask 316A.

What is claimed is:
 1. A method of fabricating a semiconductor devicecomprising the steps of: successively depositing a first metal film anda first interlayer insulating film on an insulating film formed on asemiconductor substrate; forming a first mask pattern for masking firstmetal interconnect forming areas on said first interlayer insulatingfilm, and etching said first interlayer insulating film and said firstmetal film by using said first mask pattern, whereby forming openings insaid first interlayer insulating film and forming first metalinterconnects from said first metal film; filling a second interlayerinsulating film made from a different material from said firstinterlayer insulating film in said openings of said first interlayerinsulating film; forming a second mask pattern having via openingscorresponding to via hole forming areas on said first interlayerinsulating film and said second interlayer insulating film; etching saidfirst interlayer insulating film by using said second mask pattern underetching conditions that an etching rate for said first interlayerinsulating film is higher than an etching rate for said secondinterlayer insulating film, whereby forming via holes for exposing saidfirst metal interconnects in said second interlayer insulating film;depositing a second metal film on said first interlayer insulating filmand said second interlayer insulating film so as to fill said via holes;depositing a third interlayer insulating film on said second metal film;forming a third mask pattern for masking second metal interconnectforming areas on said third interlayer insulating film, and etching saidsecond interlayer insulating film and said second metal film by usingsaid third mask pattern, whereby forming openings in said thirdinterlayer insulating film and forming second metal interconnects fromsaid second metal film; and filling a fourth interlayer insulating filmin an interval in said second metal interconnects and in said openingsof said third interlayer insulating film.
 2. The method of fabricating asemiconductor device of claim 1, wherein said first interlayerinsulating film is made from a material including an inorganic componentas a main component, and said second interlayer insulating film is madefrom a material including an organic component as a main component. 3.The method of fabricating a semiconductor device of claim 1, whereinsaid second interlayer insulating film has a smaller dielectric constantthan said first interlayer insulating film.
 4. The method of fabricatinga semiconductor device of claim 1, wherein said second mask pattern is ahard mask made from a metal material.
 5. The method of fabricating asemiconductor device of claim 1, wherein each of said via openings is ina larger plan shape than each of said via holes.
 6. A method offabricating a semiconductor device comprising the steps of: successivelydepositing a first metal film and a first interlayer insulating film onan insulating film formed on a semiconductor substrate; forming a firstmask pattern for masking first metal interconnect forming areas on saidfirst interlayer insulating film, and etching said first interlayerinsulating film and said first metal film by using said first maskpattern, whereby forming openings in said first interlayer insulatingfilm and forming first metal interconnects from said first metal film;filling a second interlayer insulating film made from a differentmaterial from said first interlayer insulating film in an interval insaid first metal interconnects and in said openings of said firstinterlayer insulating film; depositing a sacrifice film of an insulatingmaterial on said first interlayer insulating film and said secondinterlayer insulating film; forming a second mask pattern for maskingsecond metal interconnect forming areas on said sacrifice film, andetching said sacrifice film by using said second mask pattern, wherebyforming interconnect patterns from said sacrifice film; filling a thirdinterlayer insulating film in an interval in said interconnect patterns;forming a third mask pattern having via openings corresponding to viahole forming areas on said interconnect patterns and said thirdinterlayer insulating film, and etching said interconnect patterns andsaid first interlayer insulating film by using said third mask patternunder etching conditions that an etching rate for said interconnectpatterns is higher than an etching rate for said third interlayerinsulating film and that an etching rate for said first interlayerinsulating film is higher than an etching rate for said secondinterlayer insulating film, whereby forming via holes for exposing saidfirst metal interconnects in said second interlayer insulating film;forming interconnect openings in said third interlayer insulating filmby removing said interconnect patterns; and filling a second metal filmin said via holes of said second interlayer insulating film and in saidinterconnect openings of said third interlayer insulating film, wherebysimultaneously forming via contacts and second metal interconnects fromsaid second metal film.
 7. The method of fabricating a semiconductordevice of claim 6, wherein said first interlayer insulating film is madefrom a material including an inorganic component as a main component,and each of said second interlayer insulating film and said thirdinterlayer insulating film is made from a material including an organiccomponent as a main component.
 8. The method of fabricating asemiconductor device of claim 6, wherein said second interlayerinsulating film and said third interlayer insulating film have smallerdielectric constants than said first interlayer insulating film.
 9. Themethod of fabricating a semiconductor device of claim 6, wherein saidthird mask pattern is a hard mask made from a metal material.
 10. Themethod of fabricating a semiconductor device of claim 6, wherein each ofsaid via openings is in a larger plan shape than each of said via holes.